Semiconductor module



FIG. 1 is a front, top and right side perspective view of asemiconductor module showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being a mirror image ofFIG. 3 ;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5 thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5 thereof;

FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 5thereof; and,

FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. 5thereof.

CLAIM The ornamental design for a semiconductor module, as shown anddescribed.